Research Explorer

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Researcher

Nivesh Mangal

Awards & Distinctions

12 Results

2021

Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling

Nivesh MangalBradley SnyderJoris Van CampenhoutGeert Van SteenbergeJeroen Missinne

A1 Journal Article in OPTICS EXPRESS

2020

Alignment-tolerant coupling interfaces for board-level integration of silicon photonics

Nivesh MangalGeert Van SteenbergeJoris Van Campenhout

Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects

Nivesh MangalJeroen MissinneJoris Van CampenhoutBradley SnyderGeert Van Steenberge

A1 Journal Article in JOURNAL OF LIGHTWAVE TECHNOLOGY

Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics

Nivesh MangalBradley SnyderJoris Van CampenhoutGeert Van SteenbergeJeroen Missinne

A1 Journal Article in IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS

2019

Alignment-tolerant interfacing of a photonic integrated circuit using back side etched silicon microlenses

Jeroen MissinneNuria Teigell BeneitezNivesh MangalJing ZhangAnton VasilievJoris Van CampenhoutBradley SnyderGünther RoelkensGeert Van Steenberge

Performance evaluation of backside emitting O-Band grating couplers for 100 μm-thick silicon photonics interposers

Nivesh MangalJeroen MissinneGeert Van SteenbergeJoris Van CampenhoutBradley Snyder

A1 Journal Article in IEEE PHOTONICS JOURNAL

Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects

Nivesh MangalJeroen MissinneJoris Van CampenhoutGeert Van SteenbergeBradley Snyder

2018

Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics

Nivesh MangalJeroen MissinneGünther RoelkensJan Van CampenhoutGeert Van SteenbergeB. Snyder

Integration of ball lens in through-package via to enable photonic chip-to-board coupling

Nivesh MangalJeroen MissinneJoris Van CampenhoutGeert Van SteenbergeBrad Snyder

Packaging and assembly challenges for 50G silicon photonics interposers

Bradley SnyderNivesh MangalGuy LepageSadhishkumar BalakrishnanXiao SunNicolas PantanoMichal RakowskiLieve BogaertsPeter De HeynPeter Verheyen et al.

2017

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

Nivesh MangalJeroen MissinneGeert Van SteenbergeJ. Van CampenhoutB. Snyder

2015

Laser processing for large area polymer photonic applications

Geert Van SteenbergeErwin BosmanJeroen MissinneKamalpreet KaurSanjeev NaithaniSandeep KalathimekkadPankaj JoshiNuria Teigell BeneitezPaolo CardileReda Gamal Moustafa Ahmed et al.