Research Explorer

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Researcher

Magi Margalit Nagar

Awards & Distinctions

11 Results

2014

The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating

Magi Margalit NagarA RadisicKatrien StrubbePM Vereecken

A1 Journal Article in ELECTROCHIMICA ACTA

2013

Systematic studies of electrochemical nucleation and growth of copper on Ru-based substrates for damascene process

Magi Margalit NagarKatrien Strubbe

The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates

Magi Margalit NagarAlec RadisicKatrien StrubbePhilippe M Vereecken

A1 Journal Article in ELECTROCHIMICA ACTA

2012

Exploration of process window for fill of sub 30 nm features by direct plating

Magi Margalit NagarAleksandar RadisicKatrien StrubbePhilippe M Vereecken

Multi-scale modeling of direct copper plating on resistive non-copper substrates

Liu YangAleksandar RadisicMagi Margalit NagarJohan DeconinckLeonardus LeunissenPhilippe M. VereeckenAlan C. West

Nucleation and growth of copper on Ru-based substrates, I : the effect of the inorganic components

Magi Margalit NagarPhilippe M VereeckenKatrien StrubbeAlexandar Radisic

Nucleation and growth of copper on Ru-based substrates, II : the effect of the suppressor additive

Magi Margalit NagarAleksandar RadisicKatrien StrubbePhilippe M Vereecken

2011

Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and 1/2 pitch lines : from coupon to full-wafer experiments

Silvia ArminiSteven DemuynckZaid El-mekkiJohan SwertsMagi Margalit NagarAleksandar RadisicNancy HeylenGerald BeyerLeonardus LeunissenPhilippe M Vereecken

2010

Copper plating on resistive substrates, diffusion barrier and alternative seed layers

A RadisicMagi Margalit NagarKatrien StrubbeS ArminiZ El-MekkiH VoldersW RuythoorenPM Vereecken

Direct copper plating on a RuTa substrate

Magi Margalit NagarA RadisicKatrien StrubbePhilippe M Vereecken

Tailoring copper island density for copper plating on a RuTa substrate

Magi Margalit NagarPhilippe VereeckenAlexandar RadisicKatrien Strubbe