Research Explorer

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Researcher

Lieven Degrendele

Awards & Distinctions

8 Results

2018

3D multifunctional composites based on large-area stretchable circuit with thermoforming technology

Yang YangThomas VervustSheila DunphySteven Van PutBjorn VandecasteeleKristof DhaenensLieven DegrendeleLothar MaderLinde De VrieseTom Martens et al.

A1 Journal Article in ADVANCED ELECTRONIC MATERIALS

2017

Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components

Bart VandeveldeFilip VanheeDavy PissoortLieven DegrendeleJohan De BaetsBart AllaertRalph LauwaertFranco ZanonRiet LabieGeert Willems

A1 Journal Article in MICROELECTRONICS RELIABILITY

2016

How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

Bart VandeveldeLieven DegrendeleMaarten CauweBart AllaertRalf LauwaertGeert Willems

2014

Reduced 2nd level solder joint life time of low-CTE mold compound packages

Bart VandeveldeRiet LabieGeert WillemsLieven DegrendeleMaarten CauweJohan De Baets

2013

In situ monitoring of urine and sweat contamination in bed linen

Bjorn Van KeymeulenLieven DegrendeleFrederick BossuytJohan De Baets

2006

A flexible polyimide based circuit for rapid heating of small objects

Bjorn VandecasteeleKristof DhaenensWim ChristiaensLieven DegrendeleM STEELA VAN LIEREJan Vanfleteren

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam SiauAlfons VervaetLieven DegrendeleJohan De BaetsAndré Van Calster

A1 Journal Article in APPLIED SURFACE SCIENCE

2003

Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers : overplating reliability considerations for the solder mask

Sam SiauLieven DegrendeleJohan De BaetsAndré Van Calster