Research Explorer

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Researcher

Liang Wang

Awards & Distinctions

5 Results

2013

Design and Technology of Ultra Thin Chip Packages for High-Frequency Applications up to 60 GHz

Liang WangJan VanfleterenWalter De RaedtMaarten Cauwe

Self-aligned flat ultra-thin chip package for flexible circuits

Liang WangMaarten CauweSteven BrebelsWalter De Raedt,Jan Vanfleteren

A1 Journal Article in CIRCUIT WORLD

2012

An approach to produce a stack of photo definable polyimide based flat UTCPs

Swarnakamal PriyabadiniTom SterkenLiang WangKristof DhaenensBjorn VandecasteeleSteven Van PutAndreas Erik PetersenJan Vanfleteren

Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

Liang WangTom SterkenMaarten CauweDieter CuypersJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Tom SterkenMaaike Op de BeeckFilip VermeirenTom TorfsLiang WangSwarnakamal PriyabadiniKristof DhaenensDieter CuypersJan Vanfleteren