Research Explorer

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Researcher

Kristof Dhaenens

Awards & Distinctions

16 Results

2019

Stretchable mould interconnect optimization : peeling automation and carrierless techniques

Bart PlovieYang YangSheila DunphyKristof DhaenensSteven Van PutFrederick BossuytJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

2018

3D multifunctional composites based on large-area stretchable circuit with thermoforming technology

Yang YangThomas VervustSheila DunphySteven Van PutBjorn VandecasteeleKristof DhaenensLieven DegrendeleLothar MaderLinde De VrieseTom Martens et al.

A1 Journal Article in ADVANCED ELECTRONIC MATERIALS

2017

Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers

Bart PlovieYang YangJoren GuillaumeSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleThomas VervustFrederick BossuytJan Vanfleteren

A1 Journal Article in ADVANCED ENGINEERING MATERIALS

Thermoplastically Shaped Wearable Medical Devices

Bart PlovieSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleFrederick BossuytJan Vanfleteren

2016

One-time deformable thermoplastic devices based on flexible circuit board technology

Bart PlovieYang YangJoren GuillaumeSheila DunphyKristof DhaenensSteven Van PutThomas VervustFrederick BossuytJan Vanfleteren

2015

2.5D smart objects using thermoplastic stretchable interconnects

Bart PlovieSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleFrederick BossuytJan Vanfleteren

2014

Fabrication and functionalization of PCB gold electrodes suitable for DNA-based electrochemical sensing

Pietro SalvoOYF HenryKristof DhaenensJLA SanchezAn GielenBW SolnestamJ LundebergCK O'SullivanJan Vanfleteren

A1 Journal Article in BIO-MEDICAL MATERIALS AND ENGINEERING

2013

One-time deformable electronics

Imen ChtiouiSheila DunphyKristof DhaenensMaaike Op de BeeckMohamed Hedi BedouiJan VanfleterenFrederick Bossuyt

2012

An approach to produce a stack of photo definable polyimide based flat UTCPs

Swarnakamal PriyabadiniTom SterkenLiang WangKristof DhaenensBjorn VandecasteeleSteven Van PutAndreas Erik PetersenJan Vanfleteren

High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Tom SterkenMaaike Op de BeeckFilip VermeirenTom TorfsLiang WangSwarnakamal PriyabadiniKristof DhaenensDieter CuypersJan Vanfleteren

2011

3D-stacking of UTCPs as a module miniaturization technology

Swarnakamal PriyabadiniAn GielenKristof DhaenensWim ChristiaensSteven Van PutGerhard KunkelAnders Erik PetersenJan Vanfleteren

In-body path loss models for implants in heterogeneous human tissues using implantable slot dipole conformal flexible antennas

Divya KurupMaria Lucia ScarpelloGünter VermeerenWout JosephKristof DhaenensFabrice AxisaLuc MartensDries Vande GinsteHendrik RogierJan Vanfleteren

A1 Journal Article in EURASIP JOURNAL ON WIRELESS COMMUNICATIONS AND NETWORKING

2010

Module miniaturization by ultra thin package stacking

Thomas LoeherDavid SchuetzeWim ChristiaensKristof DhaenensSwarnakamal PriyabadiniAndreas OstmannJan Vanfleteren

2009

Two LCOS full color projector with efficient LED illumination engine

Hüseyin MuratAykut AvciRoel BeernaertKristof DhaenensHerbert De SmetLawrence BogaertYouri MeuretHugo Thienpont

A1 Journal Article in DISPLAYS

2007

Flexible-substrate low-cost construction of a coplanar-waveguide aperture-coupled microstrip patch antenna

D DEPRETHendrik RogierKristof DhaenensJan Vanfleteren

A1 Journal Article in MICROWAVE AND OPTICAL TECHNOLOGY LETTERS

2006

A flexible polyimide based circuit for rapid heating of small objects

Bjorn VandecasteeleKristof DhaenensWim ChristiaensLieven DegrendeleM STEELA VAN LIEREJan Vanfleteren