Research Explorer

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Researcher

Koenraad Allaert

Awards & Distinctions

21 Results

1999

Photovia technology: Some important aspects for reliability

Suixin ZhangJohan De BaetsAndré Van CalsterDorina CorlatanPascal De LangheKoenraad Allaert

Photovia technology: Some important aspects for reliability.

Suixin ZhangJohan De BaetsAndré Van CalsterDorina CorlatanP DE LANGHEKoenraad Allaert

1998

The realisation of photo-via technology using multiposit as a photo imageable dielectric

Suixin ZhangMaria VereekenJ DEBAETSAndré Van CalsterJ PEETERSKoenraad Allaert

1997

Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly

S ZangM VereeckenJohan De BaetsAndré Van CalsterAlfons VervaetJ PeetersKoenraad Allaert

1996

Characterization of integrated resistors for broadband telecom printed circuit boards

J PEETERSAnn AckaertL VANDAMKoenraad AllaertM BOTTEL VAN DEN TORRENLuc MartensDaniël De Zutter

Development of an adhesive TAB joining technology

Jan VanfleterenAndré Van CalsterKris SabbeM DE CALUWEA DRAVETP KERTESZS SECHERK DECKELMANNJ WIESEE CORTES et al.

Interconnection Technology for Advanced High density Thick Films

M VRANAAndré Van CalsterR VANDEN BERGHEKoenraad Allaert

A2 Journal Article in Microelectronics International

Radiated emission of PCB tracks.

Pascal De LangheFemke OlyslagerAnn FranchoisDaniël De ZutterKoenraad Allaert

The use of integrated resistors and buried capacitance in high performance telecom printed circuit boards

J PEETERSE ROOSEL VANDAMAnn AckaertKoenraad AllaertL VAN DEN TORRENLuc Martens

1995

A new cost-effective TAB technology for small and medium volumes

A DRA VETS SECHEZAndré Van CalsterJohan De BaetsJan VanfleterenKoenraad AllaertP VETTERM FORRESTG SCHOLSK DECKELMANN et al.

Interconnection technology for advanced high density thick films

M VRANAAndré Van CalsterR VANDEN BERGHEKoenraad Allaert

Photoimageable Thick Films for Multichip Modules

M VRANAAndré Van CalsterD VANICKYW DELABARER VANDEN BERGHES DE MOLDERKoenraad Allaert

Samenwerking industrie-universiteit helpt de EMC-materie te ontmaskeren

Koenraad AllaertM CumpsPascal De LangheR De SmedtAnn FranchoisDaniël De ZutterLuc MartensFemke Olyslager

A4 Journal Article in HET INGENIEURSBLAD

1991

Failure mechanisms in dielectrics

R Vanden BergheS DemolderM SailleKoenraad AllaertAnita De BruyckerJohan De BaetsAndré Van CalsterJan VanfleterenIgor De RyckeHerbert De Smet et al.

1987

Karakterisatie van PECVD siliciumnitride en toepassing als totale passivatielaag voor chips

Koenraad AllaertH. PauwelsAndré Van Calster

1986

Evaluation of PCVD Silicon Nitride as a Total Passivation Layer for Chips.

Koenraad AllaertAndré Van CalsterAlfons Vervaet

P.C.V.D. SIN Conformal Coatings for the Improvement of the Reliability of Wire Bonded Chips.

Koenraad AllaertAndré Van CalsterAlfons Vervaet

1985

A comparison between silicon-nitride films made by PCVD of N2-SiH4/Ar and N2-SiH4/He

Koenraad AllaertAndré Van CalsterH LoosA Lequesne

A1 Journal Article in JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.

André Van CalsterJohan De BaetsJan VanfleterenA DRAVETKoenraad AllaertE CORTESK DECKELMANG SCHOLS

Fabrication of High Density Multi-Chip Modules with Standard IC Production Equipment. Hybrid Circuits, Nr. 30, pp. 27-30, 1993.

B DE MEULEMEESTERAndré Van CalsterAnita De BruyckerKoenraad Allaert

Plhoto-imageable thick films for multichipmodules. International Conference on electronic Technologies, pp. 41-45, Windsor, 1994.

M VRANAAndré Van CalsterD VANICKYW DELBARER VANDEN BERGHES DEMOLDERKoenraad Allaert