Research Explorer

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Researcher

Kamalpreet Kaur

Awards & Distinctions

12 Results

2022

Pilot testing of the 'turbidimeter', a simple, universal reader intended to complement and enhance bacterial growth detection in manual blood culture systems in low-resource settings

Barbara BarbeEllen CorsmitJasper JansKamalpreet KaurRoel BaetsJan JacobsLiselotte Hardy

A1 Journal Article in DIAGNOSTICS

2015

40 Gb/s PAM-4 transmitter IC for long-wavelength VCSEL links

Wouter SoenenRenato VaernewyckXin YinSilvia SpigaMarkus-Christian AmannKamalpreet KaurParaskeva BakopoulosJohan Bauwelinck

A1 Journal Article in IEEE PHOTONICS TECHNOLOGY LETTERS

Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms

Kamalpreet KaurAnanth SubramanianPaolo CardileRik VerplanckeJoris Van KerrebrouckSilvia SpigaRalf MeyerJohan BauwelinckRoel BaetsGeert Van Steenberge

A1 Journal Article in OPTICS EXPRESS

Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation

Kamalpreet KaurAnanth SubramanianRik VerplanckePaolo CardileJoris Van KerrebrouckS SpigaR MeyerJohan BauwelinckRoel BaetsGeert Van Steenberge

Laser processing for large area polymer photonic applications

Geert Van SteenbergeErwin BosmanJeroen MissinneKamalpreet KaurSanjeev NaithaniSandeep KalathimekkadPankaj JoshiNuria Teigell BeneitezPaolo CardileReda Gamal Moustafa Ahmed et al.

Laser-induced forward transfer for flip-chip packaging of single dies

Kamalpreet KaurGeert Van Steenberge

A1 Journal Article in JOVE-JOURNAL OF VISUALIZED EXPERIMENTS

2014

Chip-level interconnections realized via the laser-induced forward transfer technique

Kamalpreet KaurJeroen MissinneGeert Van Steenberge

Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

Kamalpreet KaurJeroen MissinneGeert Van Steenberge

A1 Journal Article in APPLIED PHYSICS LETTERS

Fluxless flip-chip bonding of single photodetector chips using laser-induced forward transfer

Kamalpreet KaurGeert Van Steenberge

2013

Assembly of optoelectronics for efficient chip-to-waveguide coupling

Erwin BosmanKamalpreet KaurJeroen MissinneBram Van HoeGeert Van Steenberge

Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components

Kamalpreet KaurJeroen MissinneBjorn VandecasteeleGeert Van SteenbergeSandeep PerincheryEdsger SmitsRajesh Mandamparabil

Optoelectronics packaging for efficient chip-to-waveguide coupling

Geert Van SteenbergeErwin BosmanJeroen MissinneBram Van HoeKamalpreet KaurSandeep KalathimekkadNuria Teigell BeneitezAhmed Elmogi