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Researcher
Frederick Bossuyt
Profile
Projects
Publications
Activities
Awards & Distinctions
107
Results
2025
An environmentally friendly carbon-printed contactless smart diaper
Joryan Sennesael
Arno Moerman
Frederick Bossuyt
Bjorn Vandecasteele
Charlotte Raepsaet
Dimitri Beeckman
Hendrik Rogier
Patrick Van Torre
A1
Journal Article
in
IEEE SENSORS JOURNAL
2025
Conveying emotions to robots through touch and sound
Qiaoqiao Ren
Remko Proesmans
Frederick Bossuyt
Jan Vanfleteren
Francis wyffels
Tony Belpaeme
P1
Conference
2025
Integration of edge-lit quantum dot coated lightguides in soft smart surfaces
Ravi Kishore
Jan Audenaert
Frederick Bossuyt
Pieter Bauwens
Bjorn Vandecasteele
Youri Meuret
A1
Journal Article
in
IEEE PHOTONICS JOURNAL
2025
Revolutionizing patient care : a comprehensive review of recent advances in flexible printed heaters for wearable medical applications
Hundessa Daba Nemomssa
Frederick Bossuyt
Bjorn Vandecasteele
Herbert De Pauw
Netsanet Workneh Gidi
Pieter Bauwens
A1
Journal Article
in
ACTUATORS
2025
2024
Study of a narrow fabric-based e-textile system : from research to field tests
Paula Veske-Lepp
Bjorn Vandecasteele
Filip Thielemans
Vera De Glas
Severine Delaplace
Bart Allaert
Kurt Dewulf
Annick Depré
Frederick Bossuyt
A1
Journal Article
in
SENSORS
2024
2023
A novel method for component positioning in thermoformed electronics
Behnam Madadnia
Frederick Bossuyt
Jan Vanfleteren
P1
Conference
2023
Design and technology for accurate component positioning in 3D thermoformed electronics
Behnam Madadnia
Jan Vanfleteren
Frederick Bossuyt
Dissertation
2023
Measuring the flex life of conductive yarns in narrow fabric
Paula Veske
Frederick Bossuyt
Filip Thielemans
Jan Vanfleteren
C1
Conference
2023
Methods to improve accuracy of electronic component positioning in thermoformed electronics
Behnam Madadnia
Jan Vanfleteren
Frederick Bossuyt
A1
Journal Article
in
MICROMACHINES
2023
Parameter study on force curves of assembled electronic components on foils during injection overmolding using simulation
Martin Hubmann
Mona Bakr
Jonas Groten
Martin Pletz
Jan Vanfleteren
Frederick Bossuyt
Behnam Madadnia
Barbara Stadlober
A1
Journal Article
in
MICROMACHINES
2023
2022
A study on over-molded copper-based flexible electronic circuits
Mona Bakr
Martin Hubmann
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
MICROMACHINES
2022
Development of a stretchable circuit and its integration method on knit fabrics for lower back injury prevention
Paula Veske-Lepp
Pieter Bauwens
Frederick Bossuyt
Tom Sterken
Joke Schuermans
Jan Vanfleteren
A2
Journal Article
in
JOURNAL OF BIOMIMETICS BIOMATERIALS AND BIOMEDICAL ENGINEERING
2022
Electronics integration into textiles : a study of technology, reliability, sustainability and applications
Paula Veske-Lepp
Jan Vanfleteren
Frederick Bossuyt
Dissertation
2022
Innovative component positioning method for thermoformed electronics
Behnam Madadnia
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
FLEXIBLE AND PRINTED ELECTRONICS
2022
Integration of electronics in plastics using injection molding processes
Mona Bakr
Jan Vanfleteren
Frederick Bossuyt
Dissertation
2022
Process optimization of injection overmolding structural electronics with regard to film distortion
Martin Hubmann
Behnam Madadnia
Jonas Groten
Martin Pletz
Jan Vanfleteren
Barbara Stadlober
Frederick Bossuyt
Jatinder Kaur
Thomas Lucyshyn
A1
Journal Article
in
POLYMERS
2022
Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics
Behnam Madadnia
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
2022
Testing for wearability and reliability of TPU lamination method in e-textiles
Paula Veske
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
SENSORS
2022
The integration of electronic circuits in plastics using injection technologies : a literature review
Mona Bakr
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
FLEXIBLE AND PRINTED ELECTRONICS
2022
Using Grubler's Criterion theory to position the electronic components in thermoformed electronics
Behnam Madadnia
Frederick Bossuyt
Jan Vanfleteren
P1
Conference
2022
Using non-stretchable structures for component positioning in thermoformed electronics
Behnam Madadnia
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
FLEXIBLE AND PRINTED ELECTRONICS
2022
2021
Over-molding of flexible polyimide-based electronic circuits
Mona Bakr
Yibo Su
Ali Rezaei
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
FLEXIBLE AND PRINTED ELECTRONICS
2021
Over-molding of two-dimensional curved shape using polyimide copper cladding foil
Mona Bakr
Yibo Su
Ali Rezaei
Frederick Bossuyt
Jan Vanfleteren
C1
Conference
2021
Reducing out-of-plane deformation of metal interconnects in structural electronics
Behnam Madadnia
Jan Vanfleteren
Frederick Bossuyt
C1
Conference
2021
2020
Development and washing reliability testing of a stretchable circuit on knit fabric
Paula Veske
Pieter Bauwens
Frederick Bossuyt
Tom Sterken
Jan Vanfleteren
A1
Journal Article
in
APPLIED SCIENCES-BASEL
2020
Flexible microsystems using over-molding technology
Mona Bakr
Frederick Bossuyt
Jan Vanfleteren
Yibo Su
P1
Conference
2020
Solar cells integration in over-molded printed electronics
Mona Bakr
Pieter Bauwens
Frederick Bossuyt
Jan Vanfleteren
Imen Chtioui
Wim Christiaens
P1
Conference
2020
Vacuum lamination of a stretchable sensor system in polypropylene
Pieter Bauwens
Frederick Bossuyt
Jan Patrick Deckers
Jan Vanfleteren
P1
Conference
2020
2019
Design automation of meandered interconnects for stretchable circuits
Bart Plovie
Jan Vanfleteren
Thomas Vervust
Andrés Felipe Vasquez Quintero
Frederick Bossuyt
A1
Journal Article
in
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
2019
Effect of overmolding process on the integrity of electronic circuits
Mona Bakr
Yibo Su
Frederick Bossuyt
Jan Vanfleteren
P1
Conference
2019
Stretchable mould interconnect optimization : peeling automation and carrierless techniques
Bart Plovie
Yang Yang
Sheila Dunphy
Kristof Dhaenens
Steven Van Put
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2019
Thermoplastic electronic circuits : design, technology and characterisation
Bart Plovie
Jan Vanfleteren
Frederick Bossuyt
Dissertation
2019
2018
2.5/3D dynamically stretchable and permanently shaped electronic circuits
Imen Chtioui
Frederick Bossuyt
Jan Vanfleteren
Med Hedi Bedoui
A1
Journal Article
in
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
2018
Stretchability : the metric for stretchable electrical interconnects
Bart Plovie
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
MICROMACHINES
2018
2017
Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers
Bart Plovie
Yang Yang
Joren Guillaume
Sheila Dunphy
Kristof Dhaenens
Steven Van Put
Bjorn Vandecasteele
Thomas Vervust
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
ADVANCED ENGINEERING MATERIALS
2017
Fabrication of fixed-shape soft smart objects by thermoplastic forming of flat stretchable circuits
Andrés Felipe Vasquez Quintero
Jan Vanfleteren
Frederick Bossuyt
Bart Plovie
Rik Verplancke
Herbert De Smet
C3
Conference
2017
Flex PCB based technology for randomly shaped circuits
Jan Vanfleteren
Frederick Bossuyt
Bart Plovie
C1
Conference
2017
One-Time Deformable Thermoplastic Devices Based on Flexible Circuit Board Technology
Bart Plovie
Maarten Cauwe
Frederick Bossuyt
Jan Vanfleteren
C3
Conference
2017
Thermoplastically Shaped Wearable Medical Devices
Bart Plovie
Sheila Dunphy
Kristof Dhaenens
Steven Van Put
Bjorn Vandecasteele
Frederick Bossuyt
Jan Vanfleteren
C3
Conference
2017
2016
Arbitrarily shaped rigid and smart objects using stretchable interconnections
Imen Chtioui
Frederick Bossuyt
Margreet de Kok
Jan Vanfleteren
Mohamed Hedi Bedoui
A1
Journal Article
in
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2016
Design and fabrication of a flexible dielectric sensor system for in situ and real-time production monitoring of glass fibre reinforced composites
Yang Yang
Gabriele Chiesura
Thomas Vervust
Frederick Bossuyt
Geert Luyckx
Joris Degrieck
Jan Vanfleteren
A1
Journal Article
in
SENSORS AND ACTUATORS A-PHYSICAL
2016
Non-destructive evaluation of an infusion process using capacitive sensing technique
Yang Yang
Thomas Vervust
Frederick Bossuyt
Jan Vanfleteren
Gabriele Chiesura
Geert Luyckx
Joris Degrieck
Markus Kaufmann
C1
Conference
2016
One-time deformable thermoplastic devices based on flexible circuit board technology
Bart Plovie
Yang Yang
Joren Guillaume
Sheila Dunphy
Kristof Dhaenens
Steven Van Put
Thomas Vervust
Frederick Bossuyt
Jan Vanfleteren
C1
Conference
2016
2015
2.5D smart objects using thermoplastic stretchable interconnects
Bart Plovie
Sheila Dunphy
Kristof Dhaenens
Steven Van Put
Bjorn Vandecasteele
Frederick Bossuyt
Jan Vanfleteren
C1
Conference
2015
Cure degree monitoring of an infusion proces by deformable electronic circuit with integrated capacitive sensors
Yang Yang
Gabriele Chiesura
Thomas Vervust
Frederick Bossuyt
Geert Luyckx
Markus Kaufmann
Joris Degrieck
Jan Vanfleteren
C1
Conference
2015
Deformable microsystem for in situ cure degree monitoring of GFRP(Glass Fibre Reinforced Plastic)
Yang Yang
Gabriele Chiesura
Thomas Vervust
Frederick Bossuyt
Geert Luyckx
Markus Kaufmann
Joris Degrieck
Jan Vanfleteren
C1
Conference
2015
Flexible and stretchable electronics for wearable health devices
Jeroen van den Brand
Margreet de Kok
Mark Koetse
Maarten Cauwe
Rik Verplancke
Frederick Bossuyt
Michal Jablonski
Jan Vanfleteren
A1
Journal Article
in
SOLID-STATE ELECTRONICS
2015
Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections
Jan Vanfleteren
Bart Plovie
Yang Yang
Jelle De Smet
Rik Verplancke
Frederick Bossuyt
Herbert De Smet
C1
Conference
2015
Stretchable 45 x 80 RGB LED display using meander wiring technology
Hideki Ohmae
Yoshihiro Tomita
Mitsuhiro Kasahara
Jeroen Schram
Edsger Smits
Jeroen Van den Brand
Frederick Bossuyt
Jan Vanfleteren
Johan De Baets
C1
Conference
2015
2014
Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers
Jan Vanfleteren
Imen Chtioui
Bart Plovie
Yang Yang
Frederick Bossuyt
Thomas Vervust
Sheila Dunphy
Bjorn Vandecasteele
P1
Conference
2014
Conformable light emitting modules
Michal Jablonski
Jan Vanfleteren
Frederick Bossuyt
Dissertation
2014
Conformable, low level light therapy platform
Michal Jablonski
Frederick Bossuyt
Jan Vanfleteren
Thomas Vervust
Herbert De Smet
P1
Conference
2014
Development of a dielectric sensor system for the on-line cure monitoring of composites
Yang Yang
Gabriele Chiesura
Geert Luyckx
Thomas Vervust
Frederick Bossuyt
markus kaufmann
Joris Degrieck
Jan Vanfleteren
P1
Conference
2014
Flexible and stretchable circuit technologies for space applications
Maarten Cauwe
Frederick Bossuyt
Johan De Baets
Jan Vanfleteren
C1
Conference
2014
Flexible and stretchable electronics for wearable healthcare
Jeroen van den Brand
Margreet de Kok
Ashok Sridhar
Maarten Cauwe
Rik Verplancke
Frederick Bossuyt
Johan De Baets
Jan Vanfleteren
P1
Conference
2014
In situ on-line cure monitoring of composites by embedded interdigital sensor
Yang Yang
Gabriele Chiesura
Geert Luyckx
Thomas Vervust
Frederick Bossuyt
markus kaufmann
Jan Vanfleteren
Joris Degrieck
C1
Conference
2014
Mechanical analysis of encapsulated metal interconnects under transversal load
Bjorn Van Keymeulen
Mario Gonzalez
Frederick Bossuyt
Johan De Baets
Jan Vanfleteren
P1
Conference
2014
2013
Conformable, light emitting devices
Michal Jablonski
Frederick Bossuyt
Jan Vanfleteren
Kunigunde ` Cherenack
Ahmed Salem
Ricardo Ureta Hortiguela
C3
Conference
2013
In situ monitoring of urine and sweat contamination in bed linen
Bjorn Van Keymeulen
Lieven Degrendele
Frederick Bossuyt
Johan De Baets
C3
Conference
2013
Lighting applications with woven textiles as substrates
Bjorn Van Keymeulen
Frederick Bossuyt
C3
Conference
2013
One-time deformable electronics
Imen Chtioui
Sheila Dunphy
Kristof Dhaenens
Maaike Op de Beeck
Mohamed Hedi Bedoui
Jan Vanfleteren
Frederick Bossuyt
C3
Conference
2013
PCB technology based stretchable circuits
Jan Vanfleteren
Mario Gonzalez
Frederick Bossuyt
Thomas Vervust
Ingrid De Wolf
Michal Jablonski
C1
Conference
2013
Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor
Michal Jablonski
Frederick Bossuyt
Jan Vanfleteren
Thomas Vervust
Hans de Vries
A1
Journal Article
in
MICROELECTRONICS RELIABILITY
2013
Stretchable circuits with horseshoe shaped conductors: embedded in elastic polymers
Amir Jahanshahi
Mario Gonzalez
Jeroen van den Brand
Frederick Bossuyt
Thomas Vervust
Rik Verplancke
Jan Vanfleteren
A1
Journal Article
in
JAPANESE JOURNAL OF APPLIED PHYSICS
2013
Stretchable electronics technology for large area applications: fabrication and mechanical characterization
Frederick Bossuyt
Thomas Vervust
Jan Vanfleteren
A1
Journal Article
in
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2013
2012
Adhesive bonding by SU-8 transfer for assembling microfluidic devices
Pietro Salvo
Rik Verplancke
Frederick Bossuyt
Daniel Latta
Bjorn Vandecasteele
Chengxun Liu
Jan Vanfleteren
A1
Journal Article
in
MICROFLUIDICS AND NANOFLUIDICS
2012
Integration of stretchable and washable electronic modules for smart textile applications
Thomas Vervust
Guy Buyle
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
JOURNAL OF THE TEXTILE INSTITUTE
2012
Plastic electronics based conformable electronic circuits
Frederick Bossuyt
Sheila Dunphy
Jan Vanfleteren
Johan De Baets
KP Morillo
J Van den Brand
P1
Conference
2012
Printed circuit board technology inspired stretchable circuits
Jan Vanfleteren
Mario Gonzalez
Frederick Bossuyt
Yung-Yu Hsu
Thomas Vervust
Ingrid De Wolf
Michal Jablonski
A1
Journal Article
in
MRS BULLETIN
2012
SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes
Jan Vanfleteren
Thomas Loeher
Mario Gonzalez
Frederick Bossuyt
Thomas Vervust
Ingrid De Wolf
Michal Jablonski
A1
Journal Article
in
CIRCUIT WORLD
2012
Short, stretchable molded interconnect reliability under 10% cyclic elongation
Michal Jablonski
Jan Vanfleteren
Thomas Vervust
Frederick Bossuyt
P1
Conference
2012
Thin-film stretchable electronics technology based on meandering interconnections: fabrication and mechanical performance
Rik Verplancke
Frederick Bossuyt
Dieter Cuypers
Jan Vanfleteren
A1
Journal Article
in
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2012
2011
A Reliable and comfortable package for wearable medical devices
Tom Sterken
Jan Vanfleteren
Frederick Bossuyt
Steven Brebels
Wim Christiaens
Thomas Vervust
Michal Jablonski
Sheila Dunphy
Filip Vermeiren
Yung-yu Hsu
et al.
C3
Conference
2011
Cyclic endurance reliability of stretchable electronic substrates
Frederick Bossuyt
Jürgen Günther
Thomas Löher
Manuel Seckel
Tom Sterken
JWC de Vries
A1
Journal Article
in
MICROELECTRONICS RELIABILITY
2011
Design and implementation of flexible and stretchable systems
Mario Gonzalez
Bart Vandevelde
Wim Christiaens
Yung-Yu Hsu
François Iker
Frederick Bossuyt
Jan Vanfleteren
Olaf van der Sluis
PHM Timmermans
A1
Journal Article
in
MICROELECTRONICS RELIABILITY
2011
Developing an advanced module for back-contact solar cells
Jonathan Govaerts
J Robbelein
M Gonzalez
I Gordon
K Baert
I De Wolf
Frederick Bossuyt
Steven Van Put
Jan Vanfleteren
A1
Journal Article
in
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2011
Novel technologies for elastic microsystems : development, characterization and applications
Frederick Bossuyt
Jan Vanfleteren
Dissertation
2011
Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization
Yung-Yu Hsu
Mario Gonzalez
Frederick Bossuyt
Jan Vanfleteren
Ingrid De Wolf
A1
Journal Article
in
IEEE TRANSACTIONS ON ELECTRON DEVICES
2011
The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects
Yung Yu Hsu
Mario Gonzalez
Frederick Bossuyt
Fabrice Axisa
Jan Vanfleteren
Ingrid De Wolf
A1
Journal Article
in
THIN SOLID FILMS
2011
Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system
Tom Sterken
Jan Vanfleteren
Tom Torfs
Maaike Op de Beeck
Frederick Bossuyt
Chris Van Hoof
P1
Conference
2011
2010
Design and analysis of a novel fine pitch and highly stretchable interconnect
Yung Yu Hsu
Mario Gonzalez
Frederick Bossuyt
Fabrice Axisa
Jan Vanfleteren
Bart Vandevelde
Ingrid De Wolf
A1
Journal Article
in
MICROELECTRONICS INTERNATIONAL
2010
From single conductive layer to double conductive layer stretchable electronics
Frederick Bossuyt
Thomas Vervust
Fabrice Axisa
Jan Vanfleteren
C3
Conference
2010
Lifetime of stretchable meander-shaped copper conductors in PDMS subjected to cyclic elongation
Tom Sterken
Frederick Bossuyt
Rik Verplancke
Thomas Vervust
Fabrice Axisa
Jan Vanfleteren
C3
Conference
2010
Performance of a new type of module based on back-contact solar cells
Jonathan Govaerts
Jo Robbelein
Chun Gong
Bartek J Pawlak
Mario Gonzalez
Ingrid De Wolf
Frederick Bossuyt
Steven Van Put
Ivan Gordon
Kris Baert
et al.
P1
Conference
2010
Reliability assessment of stretchable interconnects
Yung Yu Hsu
B Dimcic
Mario Gonzalez
Frederick Bossuyt
Jan Vanfleteren
Ingrid De Wolf
C3
Conference
2010
Stretchable and washable electronics for embedding in textiles
Thomas Vervust
Frederick Bossuyt
Fabrice Axisa
Jan Vanfleteren
C1
Conference
2010
The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit
Yung Yu Hsu
Mario Gonzalez
Frederick Bossuyt
Fabrice Axisa
Jan Vanfleteren
Ingrid De Wolf
A1
Journal Article
in
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2010
Thermo-mechanical analysis of flexible and stretchable systems
Mario Gonzalez
Bart Vandevelde
Wim Christiaens
Yung Yu Hsu
Francois Iker
Frederick Bossuyt
Jan Vanfleteren
Olaf Van der Sluis
Pieter Timmermans
C1
Conference
2010
Thin-film interconnection technology for use in a stretchable cell culture platform
Rik Verplancke
Frederick Bossuyt
Tom Sterken
Jan Vanfleteren
C3
Conference
2010
2009
A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substrate
Frederick Bossuyt
Thomas Vervust
Fabrice Axisa
Jan Vanfleteren
P1
Conference
2009
Design and implementation of advanced systems in a flexible-stretchable technology for biomedical applications
R Carta
P Jourand
B Hermans
J Thoné
Dominique Brosteaux
Thomas Vervust
Frederick Bossuyt
Fabrice Axisa
Jan Vanfleteren
R Puers
A1
Journal Article
in
SENSORS AND ACTUATORS A-PHYSICAL
2009
Design and performance of metal conductors for stretchable electronic circuits
Mario Gonzalez
Fabrice Axisa
Frederick Bossuyt
Yung Yu Hsu
Bart Vandevelde
Jan Vanfleteren
A1
Journal Article
in
CIRCUIT WORLD
2009
In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect
Yung-Yu Hsu
Mario Gonzalez
Frederick Bossuyt
Fabrice Axisa
Jan Vanfleteren
Ingrid De Wolf
A1
Journal Article
in
JOURNAL OF MATERIALS RESEARCH
2009
In vitro cytotoxicity testing and the application of elastic interconnection technology for short-term implantable electronics
Dominique Brosteaux
Evi Lippens
Maria Cornelissen
Etienne Schacht
Riccardo Carta
Philippe Jourand
Robert Puers
Fabrice Axisa
Thomas Vervust
Frederick Bossuyt
et al.
P1
Conference
2009
2008
Design and performance of metal conductors for stretchable electronic circuits
M. Gonzalez
Fabrice Axisa
Frederick Bossuyt
Y. Hsu
B. Vandevelde
Jan Vanfleteren
P1
Conference
2008
Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology
Jan Vanfleteren
Fabrice Axisa
Dominique Brosteaux
Frederick Bossuyt
Eva De Leersnyder
Thomas Vervust
Benoît Huyghe
Jeroen Missinne
Rik Verplancke
Mario Gonzalez
C3
Conference
2008
Laser based fast prototyping methodology of producing stretchable and conformable electronic systems
Fabrice Axisa
Frederick Bossuyt
Thomas Vervust
Jan Vanfleteren
P1
Conference
2008
Stretchable engineering technologies for the development of advanced stretchable polymeric systems
Fabrice Axisa
Frederick Bossuyt
Jeroen Missinne
Rik Verplancke
Thomas Vervust
Jan Vanfleteren
P1
Conference
2008
The HOP sensor: wireless motion sensor
Bart Kuyken
Wouter Verstichel
Frederick Bossuyt
Jan Vanfleteren
Michiel Demey
Marc Leman
C1
Conference
2008
The musical synchrotron: using wireless motion sensors to study how social interaction affects synchronization with musical tempo
Michiel Demey
Marc Leman
Frederick Bossuyt
Jan Vanfleteren
C1
Conference
2008
2007
Biomedical stretchable sytems using MID based stretchable electronics technology
Fabrice Axisa
Dominique Brosteaux
Eva De Leersnyder
Frederick Bossuyt
Jan Vanfleteren
B Hermans
R Puers
P1
Conference
2007
Elastic and conformable electronic circuits and assemblies using MID in polymer
Fabrice Axisa
Dominique Brosteaux
Eva De Leersnyder
Frederick Bossuyt
M Gonzalez
M Vandenbulcke
Jan Vanfleteren
P1
Conference
2007
Low cost elastic and conformable electronic circuits and assemblies using MID in stretchable polymer
Fabrice Axisa
Dominique Brosteaux
Eva De Leersnyder
Frederick Bossuyt
M Gonzalez
M Vanden Bulcke
Jan Vanfleteren
C1
Conference
2007
Low cost, biocompatible elastic and conformable electronic technologies using MID in stretchable polymer
Fabrice Axisa
Dominique Brosteaux
Eva De Leersnyder
Frederick Bossuyt
M Gonzalez
Nele De Smet
Etienne Schacht
Monika Rymarczyk-Machal
Jan Vanfleteren
P1
Conference
2007
2002
De luchtindex als richtwaarde voor de verweefbaarheid van garens op de luchtstraalweefmachine.
K DEWITTE
J VERVISCH
Patrick Puissant
Lieva Van Langenhove
Frederick Bossuyt
A4
Journal Article
in
UNITEX. TWEEMAANDELIJKS TIJDSCHRIFT VOOR DE TEXTIELINDUSTRIE
2002
2001
De luchtindex als richtwaarde voor de verweefbaarheid van garens op de luchtstraalweefmachine.
Lieva Van Langenhove
J VERVISCH
K DEWITTE
Frederick Bossuyt
A4
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in
UNITEX. TWEEMAANDELIJKS TIJDSCHRIFT VOOR DE TEXTIELINDUSTRIE
2001
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Evaluatie van proefmethodes ter bepaling van de luchtvriendelijkheid van inslaggarens voor luchtweefmachines
J Vervisch
Lieva Van Langenhove
K Dewitte
Frederick Bossuyt
A4
Journal Article
in
UNITEX. TWEEMAANDELIJKS TIJDSCHRIFT VOOR DE TEXTIELINDUSTRIE
2000