Research Explorer

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Researcher

Frederick Bossuyt

Publications & Research Data

Awards & Distinctions

108 Results

2025

An environmentally friendly carbon-printed contactless smart diaper

Joryan SennesaelArno MoermanFrederick BossuytBjorn VandecasteeleCharlotte RaepsaetDimitri BeeckmanHendrik RogierPatrick Van Torre

A1 Journal Article in IEEE SENSORS JOURNAL

Conveying emotions to robots through touch and sound

Qiaoqiao RenRemko ProesmansFrederick BossuytJan VanfleterenFrancis wyffelsTony Belpaeme

Development of 3D-Formed Textile-Based Electrodes with Flexible Interconnect Ribbon

Paula Veske-LeppGlenn Van SteenkisteSvea ThienpondtJoris CoolsHerbert De PauwFrederick Bossuyt

U Journal Article in Sensors

Integration of edge-lit quantum dot coated lightguides in soft smart surfaces

Ravi KishoreJan AudenaertFrederick BossuytPieter BauwensBjorn VandecasteeleYouri Meuret

A1 Journal Article in IEEE PHOTONICS JOURNAL

Revolutionizing patient care : a comprehensive review of recent advances in flexible printed heaters for wearable medical applications

Hundessa Daba NemomssaFrederick BossuytBjorn VandecasteeleHerbert De PauwNetsanet Workneh GidiPieter Bauwens

A1 Journal Article in ACTUATORS

2024

Study of a narrow fabric-based e-textile system : from research to field tests

Paula Veske-LeppBjorn VandecasteeleFilip ThielemansVera De GlasSeverine DelaplaceBart AllaertKurt DewulfAnnick DepréFrederick Bossuyt

A1 Journal Article in SENSORS

2023

A novel method for component positioning in thermoformed electronics

Behnam MadadniaFrederick BossuytJan Vanfleteren

Design and technology for accurate component positioning in 3D thermoformed electronics

Behnam MadadniaJan VanfleterenFrederick Bossuyt

Measuring the flex life of conductive yarns in narrow fabric

Paula VeskeFrederick BossuytFilip ThielemansJan Vanfleteren

Methods to improve accuracy of electronic component positioning in thermoformed electronics

Behnam MadadniaJan VanfleterenFrederick Bossuyt

A1 Journal Article in MICROMACHINES

Parameter study on force curves of assembled electronic components on foils during injection overmolding using simulation

Martin HubmannMona BakrJonas GrotenMartin PletzJan VanfleterenFrederick BossuytBehnam MadadniaBarbara Stadlober

A1 Journal Article in MICROMACHINES

2022

A study on over-molded copper-based flexible electronic circuits

Mona BakrMartin HubmannFrederick BossuytJan Vanfleteren

A1 Journal Article in MICROMACHINES

Development of a stretchable circuit and its integration method on knit fabrics for lower back injury prevention

Paula Veske-LeppPieter BauwensFrederick BossuytTom SterkenJoke SchuermansJan Vanfleteren

A2 Journal Article in JOURNAL OF BIOMIMETICS BIOMATERIALS AND BIOMEDICAL ENGINEERING

Electronics integration into textiles : a study of technology, reliability, sustainability and applications

Paula Veske-LeppJan VanfleterenFrederick Bossuyt

Innovative component positioning method for thermoformed electronics

Behnam MadadniaFrederick BossuytJan Vanfleteren

A1 Journal Article in FLEXIBLE AND PRINTED ELECTRONICS

Integration of electronics in plastics using injection molding processes

Mona BakrJan VanfleterenFrederick Bossuyt

Process optimization of injection overmolding structural electronics with regard to film distortion

Martin HubmannBehnam MadadniaJonas GrotenMartin PletzJan VanfleterenBarbara StadloberFrederick BossuytJatinder KaurThomas Lucyshyn

A1 Journal Article in POLYMERS

Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics

Behnam MadadniaFrederick BossuytJan Vanfleteren

A1 Journal Article in INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Testing for wearability and reliability of TPU lamination method in e-textiles

Paula VeskeFrederick BossuytJan Vanfleteren

A1 Journal Article in SENSORS

The integration of electronic circuits in plastics using injection technologies : a literature review

Mona BakrFrederick BossuytJan Vanfleteren

A1 Journal Article in FLEXIBLE AND PRINTED ELECTRONICS

Using Grubler's Criterion theory to position the electronic components in thermoformed electronics

Behnam MadadniaFrederick BossuytJan Vanfleteren

Using non-stretchable structures for component positioning in thermoformed electronics

Behnam MadadniaFrederick BossuytJan Vanfleteren

A1 Journal Article in FLEXIBLE AND PRINTED ELECTRONICS

2021

Over-molding of flexible polyimide-based electronic circuits

Mona BakrYibo SuAli RezaeiFrederick BossuytJan Vanfleteren

A1 Journal Article in FLEXIBLE AND PRINTED ELECTRONICS

Over-molding of two-dimensional curved shape using polyimide copper cladding foil

Mona BakrYibo SuAli RezaeiFrederick BossuytJan Vanfleteren

Reducing out-of-plane deformation of metal interconnects in structural electronics

Behnam MadadniaJan VanfleterenFrederick Bossuyt

2020

Development and washing reliability testing of a stretchable circuit on knit fabric

Paula VeskePieter BauwensFrederick BossuytTom SterkenJan Vanfleteren

A1 Journal Article in APPLIED SCIENCES-BASEL

Flexible microsystems using over-molding technology

Mona BakrFrederick BossuytJan VanfleterenYibo Su

Solar cells integration in over-molded printed electronics

Mona BakrPieter BauwensFrederick BossuytJan VanfleterenImen ChtiouiWim Christiaens

Vacuum lamination of a stretchable sensor system in polypropylene

Pieter BauwensFrederick BossuytJan Patrick DeckersJan Vanfleteren

2019

Design automation of meandered interconnects for stretchable circuits

Bart PlovieJan VanfleterenThomas VervustAndrés Felipe Vasquez QuinteroFrederick Bossuyt

A1 Journal Article in IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS

Effect of overmolding process on the integrity of electronic circuits

Mona BakrYibo SuFrederick BossuytJan Vanfleteren

Stretchable mould interconnect optimization : peeling automation and carrierless techniques

Bart PlovieYang YangSheila DunphyKristof DhaenensSteven Van PutFrederick BossuytJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Thermoplastic electronic circuits : design, technology and characterisation

Bart PlovieJan VanfleterenFrederick Bossuyt

2018

2.5/3D dynamically stretchable and permanently shaped electronic circuits

Imen ChtiouiFrederick BossuytJan VanfleterenMed Hedi Bedoui

A1 Journal Article in MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

Stretchability : the metric for stretchable electrical interconnects

Bart PlovieFrederick BossuytJan Vanfleteren

A1 Journal Article in MICROMACHINES

2017

Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers

Bart PlovieYang YangJoren GuillaumeSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleThomas VervustFrederick BossuytJan Vanfleteren

A1 Journal Article in ADVANCED ENGINEERING MATERIALS

Fabrication of fixed-shape soft smart objects by thermoplastic forming of flat stretchable circuits

Andrés Felipe Vasquez QuinteroJan VanfleterenFrederick BossuytBart PlovieRik VerplanckeHerbert De Smet

Flex PCB based technology for randomly shaped circuits

Jan VanfleterenFrederick BossuytBart Plovie

One-Time Deformable Thermoplastic Devices Based on Flexible Circuit Board Technology

Bart PlovieMaarten CauweFrederick BossuytJan Vanfleteren

Thermoplastically Shaped Wearable Medical Devices

Bart PlovieSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleFrederick BossuytJan Vanfleteren

2016

Arbitrarily shaped rigid and smart objects using stretchable interconnections

Imen ChtiouiFrederick BossuytMargreet de KokJan VanfleterenMohamed Hedi Bedoui

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Design and fabrication of a flexible dielectric sensor system for in situ and real-time production monitoring of glass fibre reinforced composites

Yang YangGabriele ChiesuraThomas VervustFrederick BossuytGeert LuyckxJoris DegrieckJan Vanfleteren

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

Non-destructive evaluation of an infusion process using capacitive sensing technique

Yang YangThomas VervustFrederick BossuytJan VanfleterenGabriele ChiesuraGeert LuyckxJoris DegrieckMarkus Kaufmann

One-time deformable thermoplastic devices based on flexible circuit board technology

Bart PlovieYang YangJoren GuillaumeSheila DunphyKristof DhaenensSteven Van PutThomas VervustFrederick BossuytJan Vanfleteren

2015

2.5D smart objects using thermoplastic stretchable interconnects

Bart PlovieSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleFrederick BossuytJan Vanfleteren

Cure degree monitoring of an infusion proces by deformable electronic circuit with integrated capacitive sensors

Yang YangGabriele ChiesuraThomas VervustFrederick BossuytGeert LuyckxMarkus KaufmannJoris DegrieckJan Vanfleteren

Deformable microsystem for in situ cure degree monitoring of GFRP(Glass Fibre Reinforced Plastic)

Yang YangGabriele ChiesuraThomas VervustFrederick BossuytGeert LuyckxMarkus KaufmannJoris DegrieckJan Vanfleteren

Flexible and stretchable electronics for wearable health devices

Jeroen van den BrandMargreet de KokMark KoetseMaarten CauweRik VerplanckeFrederick BossuytMichal JablonskiJan Vanfleteren

A1 Journal Article in SOLID-STATE ELECTRONICS

Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections

Jan VanfleterenBart PlovieYang YangJelle De SmetRik VerplanckeFrederick BossuytHerbert De Smet

Stretchable 45 x 80 RGB LED display using meander wiring technology

Hideki OhmaeYoshihiro TomitaMitsuhiro KasaharaJeroen SchramEdsger SmitsJeroen Van den BrandFrederick BossuytJan VanfleterenJohan De Baets

2014

Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers

Jan VanfleterenImen ChtiouiBart PlovieYang YangFrederick BossuytThomas VervustSheila DunphyBjorn Vandecasteele

Conformable light emitting modules

Michal JablonskiJan VanfleterenFrederick Bossuyt

Conformable, low level light therapy platform

Michal JablonskiFrederick BossuytJan VanfleterenThomas VervustHerbert De Smet

Development of a dielectric sensor system for the on-line cure monitoring of composites

Yang YangGabriele ChiesuraGeert LuyckxThomas VervustFrederick Bossuytmarkus kaufmannJoris DegrieckJan Vanfleteren

Flexible and stretchable circuit technologies for space applications

Maarten CauweFrederick BossuytJohan De BaetsJan Vanfleteren

Flexible and stretchable electronics for wearable healthcare

Jeroen van den BrandMargreet de KokAshok SridharMaarten CauweRik VerplanckeFrederick BossuytJohan De BaetsJan Vanfleteren

In situ on-line cure monitoring of composites by embedded interdigital sensor

Yang YangGabriele ChiesuraGeert LuyckxThomas VervustFrederick Bossuytmarkus kaufmannJan VanfleterenJoris Degrieck

Mechanical analysis of encapsulated metal interconnects under transversal load

Bjorn Van KeymeulenMario GonzalezFrederick BossuytJohan De BaetsJan Vanfleteren

2013

Conformable, light emitting devices

Michal JablonskiFrederick BossuytJan VanfleterenKunigunde ` CherenackAhmed SalemRicardo Ureta Hortiguela

In situ monitoring of urine and sweat contamination in bed linen

Bjorn Van KeymeulenLieven DegrendeleFrederick BossuytJohan De Baets

Lighting applications with woven textiles as substrates

Bjorn Van KeymeulenFrederick Bossuyt

One-time deformable electronics

Imen ChtiouiSheila DunphyKristof DhaenensMaaike Op de BeeckMohamed Hedi BedouiJan VanfleterenFrederick Bossuyt

PCB technology based stretchable circuits

Jan VanfleterenMario GonzalezFrederick BossuytThomas VervustIngrid De WolfMichal Jablonski

Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor

Michal JablonskiFrederick BossuytJan VanfleterenThomas VervustHans de Vries

A1 Journal Article in MICROELECTRONICS RELIABILITY

Stretchable circuits with horseshoe shaped conductors: embedded in elastic polymers

Amir JahanshahiMario GonzalezJeroen van den BrandFrederick BossuytThomas VervustRik VerplanckeJan Vanfleteren

A1 Journal Article in JAPANESE JOURNAL OF APPLIED PHYSICS

Stretchable electronics technology for large area applications: fabrication and mechanical characterization

Frederick BossuytThomas VervustJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

2012

Adhesive bonding by SU-8 transfer for assembling microfluidic devices

Pietro SalvoRik VerplanckeFrederick BossuytDaniel LattaBjorn VandecasteeleChengxun LiuJan Vanfleteren

A1 Journal Article in MICROFLUIDICS AND NANOFLUIDICS

Integration of stretchable and washable electronic modules for smart textile applications

Thomas VervustGuy BuyleFrederick BossuytJan Vanfleteren

A1 Journal Article in JOURNAL OF THE TEXTILE INSTITUTE

Plastic electronics based conformable electronic circuits

Frederick BossuytSheila DunphyJan VanfleterenJohan De BaetsKP MorilloJ Van den Brand

Printed circuit board technology inspired stretchable circuits

Jan VanfleterenMario GonzalezFrederick BossuytYung-Yu HsuThomas VervustIngrid De WolfMichal Jablonski

A1 Journal Article in MRS BULLETIN

SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes

Jan VanfleterenThomas LoeherMario GonzalezFrederick BossuytThomas VervustIngrid De WolfMichal Jablonski

A1 Journal Article in CIRCUIT WORLD

Short, stretchable molded interconnect reliability under 10% cyclic elongation

Michal JablonskiJan VanfleterenThomas VervustFrederick Bossuyt

Thin-film stretchable electronics technology based on meandering interconnections: fabrication and mechanical performance

Rik VerplanckeFrederick BossuytDieter CuypersJan Vanfleteren

A1 Journal Article in JOURNAL OF MICROMECHANICS AND MICROENGINEERING

2011

A Reliable and comfortable package for wearable medical devices

Tom SterkenJan VanfleterenFrederick BossuytSteven BrebelsWim ChristiaensThomas VervustMichal JablonskiSheila DunphyFilip VermeirenYung-yu Hsu et al.

Cyclic endurance reliability of stretchable electronic substrates

Frederick BossuytJürgen GüntherThomas LöherManuel SeckelTom SterkenJWC de Vries

A1 Journal Article in MICROELECTRONICS RELIABILITY

Design and implementation of flexible and stretchable systems

Mario GonzalezBart VandeveldeWim ChristiaensYung-Yu HsuFrançois IkerFrederick BossuytJan VanfleterenOlaf van der SluisPHM Timmermans

A1 Journal Article in MICROELECTRONICS RELIABILITY

Developing an advanced module for back-contact solar cells

Jonathan GovaertsJ RobbeleinM GonzalezI GordonK BaertI De WolfFrederick BossuytSteven Van PutJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Novel technologies for elastic microsystems : development, characterization and applications

Frederick BossuytJan Vanfleteren

Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization

Yung-Yu HsuMario GonzalezFrederick BossuytJan VanfleterenIngrid De Wolf

A1 Journal Article in IEEE TRANSACTIONS ON ELECTRON DEVICES

The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

Yung Yu HsuMario GonzalezFrederick BossuytFabrice AxisaJan VanfleterenIngrid De Wolf

A1 Journal Article in THIN SOLID FILMS

Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system

Tom SterkenJan VanfleterenTom TorfsMaaike Op de BeeckFrederick BossuytChris Van Hoof

2010

Design and analysis of a novel fine pitch and highly stretchable interconnect

Yung Yu HsuMario GonzalezFrederick BossuytFabrice AxisaJan VanfleterenBart VandeveldeIngrid De Wolf

A1 Journal Article in MICROELECTRONICS INTERNATIONAL

From single conductive layer to double conductive layer stretchable electronics

Frederick BossuytThomas VervustFabrice AxisaJan Vanfleteren

Lifetime of stretchable meander-shaped copper conductors in PDMS subjected to cyclic elongation

Tom SterkenFrederick BossuytRik VerplanckeThomas VervustFabrice AxisaJan Vanfleteren

Performance of a new type of module based on back-contact solar cells

Jonathan GovaertsJo RobbeleinChun GongBartek J PawlakMario GonzalezIngrid De WolfFrederick BossuytSteven Van PutIvan GordonKris Baert et al.

Reliability assessment of stretchable interconnects

Yung Yu HsuB DimcicMario GonzalezFrederick BossuytJan VanfleterenIngrid De Wolf

Stretchable and washable electronics for embedding in textiles

Thomas VervustFrederick BossuytFabrice AxisaJan Vanfleteren

The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit

Yung Yu HsuMario GonzalezFrederick BossuytFabrice AxisaJan VanfleterenIngrid De Wolf

A1 Journal Article in JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Thermo-mechanical analysis of flexible and stretchable systems

Mario GonzalezBart VandeveldeWim ChristiaensYung Yu HsuFrancois IkerFrederick BossuytJan VanfleterenOlaf Van der SluisPieter Timmermans

Thin-film interconnection technology for use in a stretchable cell culture platform

Rik VerplanckeFrederick BossuytTom SterkenJan Vanfleteren

2009

A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substrate

Frederick BossuytThomas VervustFabrice AxisaJan Vanfleteren

Design and implementation of advanced systems in a flexible-stretchable technology for biomedical applications

R CartaP JourandB HermansJ ThonéDominique BrosteauxThomas VervustFrederick BossuytFabrice AxisaJan VanfleterenR Puers

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

Design and performance of metal conductors for stretchable electronic circuits

Mario GonzalezFabrice AxisaFrederick BossuytYung Yu HsuBart VandeveldeJan Vanfleteren

A1 Journal Article in CIRCUIT WORLD

In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect

Yung-Yu HsuMario GonzalezFrederick BossuytFabrice AxisaJan VanfleterenIngrid De Wolf

A1 Journal Article in JOURNAL OF MATERIALS RESEARCH

In vitro cytotoxicity testing and the application of elastic interconnection technology for short-term implantable electronics

Dominique BrosteauxEvi LippensMaria CornelissenEtienne SchachtRiccardo CartaPhilippe JourandRobert PuersFabrice AxisaThomas VervustFrederick Bossuyt et al.

2008

Design and performance of metal conductors for stretchable electronic circuits

M. GonzalezFabrice AxisaFrederick BossuytY. HsuB. VandeveldeJan Vanfleteren

Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology

Jan VanfleterenFabrice AxisaDominique BrosteauxFrederick BossuytEva De LeersnyderThomas VervustBenoît HuygheJeroen MissinneRik VerplanckeMario Gonzalez

Laser based fast prototyping methodology of producing stretchable and conformable electronic systems

Fabrice AxisaFrederick BossuytThomas VervustJan Vanfleteren

Stretchable engineering technologies for the development of advanced stretchable polymeric systems

Fabrice AxisaFrederick BossuytJeroen MissinneRik VerplanckeThomas VervustJan Vanfleteren

The HOP sensor: wireless motion sensor

Bart KuykenWouter VerstichelFrederick BossuytJan VanfleterenMichiel DemeyMarc Leman

The musical synchrotron: using wireless motion sensors to study how social interaction affects synchronization with musical tempo

Michiel DemeyMarc LemanFrederick BossuytJan Vanfleteren

2007

Biomedical stretchable sytems using MID based stretchable electronics technology

Fabrice AxisaDominique BrosteauxEva De LeersnyderFrederick BossuytJan VanfleterenB HermansR Puers

Elastic and conformable electronic circuits and assemblies using MID in polymer

Fabrice AxisaDominique BrosteauxEva De LeersnyderFrederick BossuytM GonzalezM VandenbulckeJan Vanfleteren

Low cost elastic and conformable electronic circuits and assemblies using MID in stretchable polymer

Fabrice AxisaDominique BrosteauxEva De LeersnyderFrederick BossuytM GonzalezM Vanden BulckeJan Vanfleteren

Low cost, biocompatible elastic and conformable electronic technologies using MID in stretchable polymer

Fabrice AxisaDominique BrosteauxEva De LeersnyderFrederick BossuytM GonzalezNele De SmetEtienne SchachtMonika Rymarczyk-MachalJan Vanfleteren

2002

De luchtindex als richtwaarde voor de verweefbaarheid van garens op de luchtstraalweefmachine.

K DEWITTEJ VERVISCHPatrick PuissantLieva Van LangenhoveFrederick Bossuyt

A4 Journal Article in UNITEX. TWEEMAANDELIJKS TIJDSCHRIFT VOOR DE TEXTIELINDUSTRIE

2001

De luchtindex als richtwaarde voor de verweefbaarheid van garens op de luchtstraalweefmachine.

Lieva Van LangenhoveJ VERVISCHK DEWITTEFrederick Bossuyt

A4 Journal Article in UNITEX. TWEEMAANDELIJKS TIJDSCHRIFT VOOR DE TEXTIELINDUSTRIE

2000

Evaluatie van proefmethodes ter bepaling van de luchtvriendelijkheid van inslaggarens voor luchtweefmachines

J VervischLieva Van LangenhoveK DewitteFrederick Bossuyt

A4 Journal Article in UNITEX. TWEEMAANDELIJKS TIJDSCHRIFT VOOR DE TEXTIELINDUSTRIE