Research Explorer

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Researcher

Erwin Bosman

Publications & Research Data

Awards & Distinctions

75 Results

2017

Flexible hybrid integration of photonic and electronic chips using aerosol-jet printing

Ahmed ElmogiWouter SoenenErwin BosmanJeroen MissinneSilvia SpigaM.-C. AmannJohan BauwelinckGeert Van Steenberge

Integrated polymer polarization rotator based on tilted laser ablation

Giannis PoulopoulosDimitrios KalavrouziotisJeroen MissinneErwin BosmanGeert Van SteenbergeDimitrios ApostolopoulosHercules Avramopoulos

2016

Comparison of epoxy- and siloxane-based single-mode optical waveguides defined by direct-write lithography

Ahmed ElmogiErwin BosmanJeroen MissinneGeert Van Steenberge

A1 Journal Article in OPTICAL MATERIALS

Multi-level optical signal generation using a segmented-electrode InP IQ-MZM with integrated CMOS binary drivers

Michael VanhoeckeN ArgyrisA AimoneS DrisD ApostolopoulosKoen VerheyenRenato VaernewyckGuy TorfsXin YinErwin Bosman et al.

Polymer micro- and nanophotonic sensors realized using replication technologies

Jeroen MissinneNuria Teigell BeneitezMarie-Aline MattelinAhmed ElmogiErwin BosmanGeert Van Steenberge

Scalable electro-photonic integration concept based on polymer waveguides

Erwin BosmanGeert Van SteenbergeArjen BoersmaSjoukje WiegersmaPeter HarsmaMikko KarppinenTia KorhonenBert-Jan OffreinRoger DangelAidan Daly et al.

2015

Bragg grating sensors in laser-written single mode polymer waveguides

Jeroen MissinneAnton VasilievAhmed ElmogiNuria Teigell BeneitezErwin BosmanBram Van HoeGeert Van Steenberge

Laser processing for large area polymer photonic applications

Geert Van SteenbergeErwin BosmanJeroen MissinneKamalpreet KaurSanjeev NaithaniSandeep KalathimekkadPankaj JoshiNuria Teigell BeneitezPaolo CardileReda Gamal Moustafa Ahmed et al.

lOptical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL

Mikko KarppinenNoora SalminenTia KorhonenTeemu AlajokiJarno PetäjäErwin BosmanGeert Van SteenbergeJohn JusticeUmar KhanBrian Corbett et al.

2014

Polymer integration of optoelectronic devices in on-board and board-to-board optical communication systems

Erwin BosmanBram Van HoeJeroen MissinneGeert Van Steenberge

Stretchable optical waveguides

Jeroen MissinneSandeep KalathimekkadBram Van HoeErwin BosmanJan VanfleterenGeert Van Steenberge

A1 Journal Article in OPTICS EXPRESS

2013

Assembly of optoelectronics for efficient chip-to-waveguide coupling

Erwin BosmanKamalpreet KaurJeroen MissinneBram Van HoeGeert Van Steenberge

Board-level single-mode polymer optical waveguides

Ahmed ElmogiErwin BosmanSandeep KalathimekkadNuria Teigell BeneitezJeroen MissinneRafik GuindiGeert Van Steenberge

Optoelectronics packaging for efficient chip-to-waveguide coupling

Geert Van SteenbergeErwin BosmanJeroen MissinneBram Van HoeKamalpreet KaurSandeep KalathimekkadNuria Teigell BeneitezAhmed Elmogi

Photonic skins for pressure, shear and strain sensing

Bram Van HoeJeroen MissinneErwin BosmanGeert Van Steenberge

Self-written waveguides for field-installable fiber connectors

Jeroen MissinneStefano BeriMamoni DashErwin BosmanPeter DubruelJan WattéGeert Van Steenberge

Ultra-thin multi-axial shear stress sensor based on a segmented photodiode

Jeroen MissinnePlamen KostovBram Van HoeErwin BosmanWolfgang GaberlHorst ZimmermannGeert Van Steenberge

2012

Compact coupling and packaging concepts for flexible and stretchable polymer optical interconnects

Jeroen MissinneBram Van HoeErwin BosmanSandeep KalathimekkadGeert Van SteenbergePeter Van Daele

Fluorescence-based optochemical sensor on flexible foils

Sandeep KalathimekkadJeroen MissinneJuan Diego Arias EspinozaBram Van HoeErwin BosmanEdsger SmitsRajesh MandamparambilGeert Van SteenbergeJan Vanfleteren

Foil-based optical technology platform for optochemical sensors

Sandeep KalathimekkadJeroen MissinneJuan Diego Arias EspinozaBram Van HoeErwin BosmanEdsger SmitsRajesh MandamparambilGeert Van SteenbergeJan Vanfleteren

Low-cost fully integrated fiber Bragg grating interrogation system

Bram Van HoeErwin BosmanJeroen MissinneSandeep KalathimekkadG LeeZ YanK SugdenDJ WebbGeert Van SteenbergePeter Van Daele

Novel coupling and packaging approaches for optical interconnects

Bram Van HoeErwin BosmanJeroen MissinneSandeep KalathimekkadGeert Van SteenbergePeter Van Daele

Photonic incremental pressure sensor based on optical feedback in a Polymer embedded VCSEL

Bram Van HoeErwin BosmanJeroen MissinneSandeep KalathimekkadGiuseppe MelpignanoTom De GeyterGreetje GodierPeter Van DaeleGeert Van Steenberge

A1 Journal Article in IEEE PHOTONICS TECHNOLOGY LETTERS

Two axis optoelectronic tactile shear stress sensor

Jeroen MissinneErwin BosmanBram Van HoeRik VerplanckeGeert Van SteenbergeSandeep KalathimekkadPeter Van DaeleJan Vanfleteren

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

Ultra small integrated optical fiber sensing system

Bram Van HoeGraham LeeErwin BosmanJeroen MissinneSandeep KalathimekkadOliver MaskeryDavid J WebbKate SugdenPeter Van DaeleGeert Van Steenberge

A1 Journal Article in SENSORS

Ultra thin optical tactile shear sensor

Jeroen MissinneErwin BosmanBram Van HoeRik VerplanckeGeert Van SteenbergeSandeep KalathimekkadPeter Van DaeleJan Vanfleteren

2011

Embedded multiplexed polymer optical fiber sensor for esophageal manometry

Bram Van HoeErwin BosmanJeroen MissinneGeert Van SteenbergePeter Van DaeleWei ZhangIan JohnsonKate SugdenDavid J WebbKyriacos Kalli

Flexible shear sensor based on embedded optoelectronic components

Jeroen MissinneErwin BosmanBram Van HoeGeert Van SteenbergeSandeep KalathimekkadPeter Van DaeleJan Vanfleteren

A1 Journal Article in IEEE PHOTONICS TECHNOLOGY LETTERS

Packaging technology enabling flexible optical interconnections

Erwin BosmanGeert Van SteenbergeJeroen MissinneBram Van HoeSandeep KalathimekkadPeter Van Daele

System-in-foil technology

Andreas DietzelJeroen van den BrandJan VanfleterenWim ChristiaensErwin BosmanJohan De Baets

Bookchapter in Ultra-thin chip technology and applications

Toward flexible optoelectronics packaging

A4 Journal Article in SPIE NEWSROOM

Ultrathin optoelectronic device packaging in flexible carriers

Erwin BosmanJeroen MissinneBram Van HoeGeert Van SteenbergeSandeep KalathimekkadJurgen Van ErpsIvaylo MilenkovKrassimir PanajotovTim Van GijseghemPeter Dubruel et al.

A1 Journal Article in IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS

Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors

Erwin BosmanBram Van HoeJeroen MissinneGeert Van SteenbergeSandeep KalathimekkadPeter Van Daele

2010

Characterization of flexible fully embedded optical links

Erwin BosmanJohan BauwelinckKrassimir PanajotovGeert Van SteenbergeJeroen MissinneBram Van HoePeter Van Daele

Design and fabrication of embedded micro-mirror inserts for out-of-plane coupling in PCB-level optical interconnections

Jürgen Van ErpsNina HendrickxErwin BosmanPeter Van DaeleChristof DebaesHugo Thienpont

Embedded flexible optical shear sensor

Jeroen MissinneErwin BosmanBram Van HoeGeert Van SteenbergePeter Van DaeleJan Vanfleteren

Embedded high resolution sensor based on optical feedback in a Vertical Cavity Surface Emitting Laser

Bram Van HoeDeben LamonErwin BosmanGeert Van SteenbergeJeroen MissinnePauwel GoethalsPanajotov KrassimirDominiek ReynaertsJan VanfleterenPeter Van Daele

Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Jonathan GovaertsErwin BosmanWim ChristiaensJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON ADVANCED PACKAGING

Fully flexible optoelectronic foil

Erwin BosmanGeert Van SteenbergeIvaylo MilenkovKrassimir PanajotovHugo ThienpontJohan BauwelinckPeter Van Daele

A1 Journal Article in IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS

High density optical pressure sensor foil based on arrays of crossing flexible waveguides

Jeroen MissinneGeert Van SteenbergeBram Van HoeErwin BosmanChristof DebaesJürgen Van ErpsChunxiao YanEleonora FerrarisPeter Van DaeleJan Vanfleteren et al.

Highly reliable flexible active optical links

Erwin BosmanGeert Van SteenbergeBram Van HoeJeroen MissinneJan VanfleterenPeter Van Daele

A1 Journal Article in IEEE PHOTONICS TECHNOLOGY LETTERS

Integration of optical interconnections and optoelectronic components in flexible substrates

Erwin BosmanPeter Van DaeleGeert Van Steenberge

Optical fiber sensors embedded in polymer flexible foils

Bram Van HoeGeert Van SteenbergeErwin BosmanJeroen MissinneThomas GeernaertFrancis BerghmansDavid J. WebbPeter Van Daele

Packaging of opto-electronic devices for flexible applications

Erwin BosmanGeert Van SteenbergeJeroen MissinneBram Van HoePeter Van Daele

UTCP: a novel polyimide-based ultra-thin chip packaging technology

Wim ChristiaensErwin BosmanJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

2009

Fabrication processes for embedding thin chips in flat flexible substrates

Jonathan GovaertsWim ChristiaensErwin BosmanJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON ADVANCED PACKAGING

Fully embedded optical and electrical interconnections in flexible foils

Erwin BosmanGeert Van SteenbergePeter GeerinckJan VanfleterenPeter Van Daele

2008

Active optical links embedded in flexible substrates

Erwin BosmanGeert Van SteenbergeWim ChristiaensNina HendrickxJan VanfleterenPeter Van Daele

Coupling light to and from optical boards

Peter Van DaeleNina HendrickxGeert Van SteenbergeErwin Bosman

Coupling structures for out-of-plane coupling in optical PCBs

Nina HendrickxJürgen Van ErpsErwin BosmanHugo ThienpontPeter Van Daele

Development of flexible materials for photonic optical skins

Tim Van GijseghemErwin BosmanPeter Van DaeleT. GeernaertT. NasilowskiH. OttevaereH. ThienpontM. DevolderD. ReynaertsE. Schacht et al.

Embedded 45° micro-mirror for out-of-plane coupling in optical PCBs

Nina HendrickxJ. Van ErpsErwin BosmanC. DebaesH. ThienpontPeter Van Daele

Embedded micromirror inserts for optical Printed Circuit Boards

Nina HendrickxJürgen Van ErpsErwin BosmanChristof DebaesHugo ThienpontPeter Van Daele

A1 Journal Article in IEEE PHOTONICS TECHNOLOGY LETTERS

Flexible embedded active optical link

Erwin BosmanGeert Van SteenbergeNina HendrickxWim ChristiaensJan VanfleterenPeter Van Daele

Flexible materials for optical applications

Tim Van GijseghemVeerle BoterbergErwin BosmanPeter Van DaeleT GEERNAERTT NASILOWSKIHeidi OttevaereHugo ThienpontE FERRARISD REYNAERTS et al.

Flexible optical interconnects

Geert Van SteenbergeErwin BosmanJeroen MissinneBram Van HoePeter Van Daele

Multiple chip integration for flat flexible electronics

Jonathan GovaertsWim ChristiaensErwin BosmanJan Vanfleteren

Towards flexible routing schemes for polymer optical interconnections on Printed Circuit Boards

Nina HendrickxGeert Van SteenbergeErwin BosmanJ Van ErpsH ThienpontPeter Van Daele

Towards flexible routing schemes for polymer optical interconnections on printed circuit boards

Nina HendrickxGeert Van SteenbergeErwin BosmanJ Van ErpsH ThienpontPeter Van Daele

2007

Embedding of optical interconnections in flexible electronics

Erwin BosmanGeert Van SteenbergePeter GeerinckWim ChristiaensJan VanfleterenPeter Van Daele

Flexible polyimide based ultra-thin chip package (UTCP)

Wim ChristiaensErwin BosmanWim HuwelWim PerduJan Vanfleteren

Laser ablation: a versatile micro-machining technology (poster)

Geert Van SteenbergeNina HendrickxErwin BosmanSteven Van PutPeter GeerinckPeter Van Daele

Multimode optical interconnections embedded in flexible electronics

Erwin BosmanGeert Van SteenbergeNina HendrickxPeter GeerinckWim ChristiaensJan VanfleterenPeter Van Daele

2006

Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board

Geert Van SteenbergeNina HendrickxPeter GeerinckErwin BosmanSteven Van PutJürgen Van ErpsHugo ThienpontPeter Van Daele

Development of a technology for fabricating low-cost parallel optical interconnects

Geert Van SteenbergeNina HendrickxPeter GeerinckErwin BosmanSteven Van PutPeter Van Daele

Laser ablation of parallel optical interconnect waveguides

Geert Van SteenbergeNina HendrickxErwin BosmanJ VAN ERPSHugo ThienpontPeter Van Daele

A1 Journal Article in IEEE PHOTONICS TECHNOLOGY LETTERS

Optical connections on flexible substrates

Erwin BosmanPeter GeerinckWim ChristiaensGeert Van SteenbergeJan VanfleterenPeter Van Daele

Optical interconnections embedded in flexible substrates

Erwin BosmanWim ChristiaensPeter GeerinckGeert Van SteenbergeJan VanfleterenPeter Van Daele

Optical interconnections embedded in flexible substrates

Erwin BosmanWim ChristiaensPeter GeerinckGeert Van SteenbergeJan VanfleterenPeter Van Daele

Ultra-thin chip package using embedding in spin-on polyimides

Wim ChristiaensErwin BosmanJan Vanfleteren

Ultra-thin chip package using embedding in spin-on polyimides

Wim ChristiaensErwin BosmanJan Vanfleteren

A4 Journal Article in GOOD-DIE NEWSLETTER

UTCP: 60 µm thick bendable package

Wim ChristiaensBart VandeveldeErwin BosmanJan Vanfleteren

2005

45° Out-of-Plane Turning Mirrors for Optical Printed Circuit Boards

Geert Van SteenbergePeter GeerinckSteven Van PutNina HendrickxErwin BosmanHeidi OttevaereHugo ThienpontPeter Van Daele

Laser patterning (invited paper)

Geert Van SteenbergeSteven Van PutNina HendrickxErwin BosmanPeter GeerinckPeter Van DaeleH SUYALM TAGHIZADEH

Multilayer Optical Interconnections Integrated on a Printed Circuit Board

Nina HendrickxGeert Van SteenbergePeter GeerinckSteven Van PutErwin BosmanPeter Van Daele