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Researcher
Behnam Madadnia
Profile
Projects
Publications
Activities
Awards & Distinctions
6
Results
2023
A novel method for component positioning in thermoformed electronics
Behnam Madadnia
Frederick Bossuyt
Jan Vanfleteren
P1
Conference
2023
2022
Innovative component positioning method for thermoformed electronics
Behnam Madadnia
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
FLEXIBLE AND PRINTED ELECTRONICS
2022
Process optimization of injection overmolding structural electronics with regard to film distortion
Martin Hubmann
Behnam Madadnia
Jonas Groten
Martin Pletz
Jan Vanfleteren
Barbara Stadlober
Frederick Bossuyt
Jatinder Kaur
Thomas Lucyshyn
A1
Journal Article
in
POLYMERS
2022
Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics
Behnam Madadnia
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
2022
Using non-stretchable structures for component positioning in thermoformed electronics
Behnam Madadnia
Frederick Bossuyt
Jan Vanfleteren
A1
Journal Article
in
FLEXIBLE AND PRINTED ELECTRONICS
2022
2021
Reducing out-of-plane deformation of metal interconnects in structural electronics
Behnam Madadnia
Jan Vanfleteren
Frederick Bossuyt
C1
Conference
2021